- use 4 layer instead of 2, SGGS stackup
- you don’t need power planes/pours
- bypass cap as close as possible to the power pin
- you don’t need to length match most signals (Ethernet, FS USB): Edge is 200mm long
- no ground cutouts under inductors or switching nodes
- set fabrication rules, don’t trust the defaults
- series termination close to the driving pin
- every ground pad gets its own ground via, as close as possible to the pad
- when switching layers, always place a return current ground via as close as possible to the signal via
- inductor dot pin (start of winding, interior) goes to the switch node
- use thermal relief on PTH pads
- no thermal relief on vias
- if at all possible, only put parts on one side